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PRODUCTS

E-DIP

World's first BT laminate E-band diplexer

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Key features
Drawing (units: mm)

Size: 3.8 x 4.5 mm

High out-of-band suppression: 60 dB+

Manufactured in low-CTE BT resin laminate

Compatible with FCCSP, BGA, CSP, SiP, etc.

High-volume & low-cost

Applications

Last-mile links

Small-cells

Fronthaul (SISO, 16MIMO, 32MIMO)

Backhaul

P2P

Sat-communications

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Technical specifications
Status

Prototype 1 - Dec 2021

Measurements - Feb 2022

Prototype 2 - July 2022

Improved rejection (60 dB +)

Improved return loss (15 dB +)

CPW + WR12 interface

Pilot production - Q4 2022

* SISO, 16MIMO & 32 MIMO configurations available

(1) - Expect 3.5 dB with all IC wire-bond transitions included. A 0.5 dB reduction is possible upon request.

Ordering information

Cost: Please inquire

Availability: Q4 2022

Please contact us using contact form below for more information